The MT-type of Inter-Connector, used for testing IC-devices in packages like BGA, QFP, SOP, Flip-Chip or Bumped Wafers, consists of parallel rows of gold-plated brass wires in a silicone rubber sheet.
Wires are positioned under an angle of 60° to ease compression and improve durability. The wire angle of 60° requires contacts to use an offset of half the thickness of the silicone rubber sheet. Randomly positioning the Inter-Connector between contact pads and providing compresssion wil realize a stable, low resistance connection.
Proper connection is provided by compression forces of 0.2 ~ 0.5 N per contact ball or land on the IC device, depending on the contact size and shape.
The MT-type is one of the derivatives of the GB-type and the base of several versions of MT-types dedicated to specialized fields of device testing. The MT-4X is having a 4 times higher wire density for fine pitch IC devices. The MT-T is providing ultra high signal transmission up to 13 Ghz due to its small sheet thickness.
The MT-P is having wires protruding the sheet surface by 20 µm to ease contacting ultra fine and mechanically sensitive devices with flat contacts like LGA packages. The protruded wires of the MT-P-type are Ni/Au-plated.
MT Type DimensionsFull data in download
|Pitch P, Ps||mm||0.05/ 0.1|
|Sheet thickness||mm||0.1 ~ 2|
|Length||mm||5 ~ 50|
|Width||mm||5 ~ 50|
|Conductive fiber diameter||µm||23/ 40|
MT Type PropertiesFull data in download
|Contact resistance||Ω||< 0.1|
|Current carrying capacity||mA/wire||50|
|Dielectric breakdown voltage||kV/mm||23 ~ 27|
|Isolation resistance (500V DC) ***||MΩ||> 10^3|
|Operating temperature range||°C||-35 ~ 100|