MT type of Inter-connector

The MT-type of Inter-Connector consists of parallel rows of gold-plated brass wires in a silicone rubber sheet, typically used for testing IC devices.

The MT-type of Inter-Connector, used for testing IC-devices in packages like BGA, QFP, SOP, Flip-Chip or Bumped Wafers, consists of parallel rows of gold-plated brass wires in a silicone rubber sheet.

Wires are positioned under an angle of 60° to ease compression and improve durability. The wire angle of 60° requires contacts to use an offset of half the thickness of the silicone rubber sheet. Randomly positioning the Inter-Connector between contact pads and providing compresssion wil realize a stable, low resistance connection.

Proper connection is provided by compression forces of 0.2 ~ 0.5 N per contact ball or land on the IC device, depending on the contact size and shape.

The MT-type is one of the derivatives of the GB-type and the base of several versions of MT-types dedicated to specialized fields of device testing. The MT-4X is having a 4 times higher wire density for fine pitch IC devices. The MT-T is providing ultra high signal transmission up to 13 Ghz due to its small sheet thickness.

The MT-P is having wires protruding the sheet surface by 20 µm to ease contacting ultra fine and mechanically sensitive devices with flat contacts like LGA packages. The protruded wires of the MT-P-type are Ni/Au-plated.

MT Type Dimensions

Full data in download
ParameterUnitValue
Pitchmm0.05/ 0.1
Sheet thicknessmm0.1 ~ 2
Lengthmm5 ~ 50
Widthmm5 ~ 50
Conductive fiber diameter µm23/ 40

MT Type Properties

Full data in download
ParameterUnitValue
Contact resistance Ω < 0.1
Current carrying capacity mA/wire50
Dielectric breakdown voltage kV/mm 23 ~ 27
Isolation resistance (500V DC) *** > 10^3
Operating temperature range °C -35 ~ 100

Design Guide

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MT Type of Inter-Connector

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