T.I.M. hard pads

Shin-Etsu T.I.M. material series of hard pads for power transistors.

Shin-Etsu T.I.M. material series of hard pads for power transistors.

Features:

  • Excellent performance due to high hardness
  • Sheet thickness 0.11 mm or more
  • Glass fiber or polyimide film reinforcement layer to obtain high physical strength
  • High electric insulation and flame resistance
  • One side adhesive optional
  • Moulded shapes like caps, tubes and custom designs available
Applications:
  • Power transistors for power supplies, power modules, energy convertors and automotive electronics
  • Thermal clad interposer for heatbonding anisotropic adhesive tape

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Thermal Interface materials

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Thermal Interface materials - hard pads

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