Shin-Etsu Sepla Film

Shin-Etsu Sepla Film® is a Super Engineering Plastic Films for lamination with other films and materials.

Shin-Etsu Sepla Film® is a Super Engineering Plastic Films; ultra thin and non-stretched.
  • non-stretched film of non-crystallized plastics
  • non-stretched and low crystallized film of crystallized plastics
  • several surface patterns

PEEK (Polyether Ether Ketone) offers outstanding physical, thermal and chemical properties resulting in excellent resistance against thermal, chemical and mechanical stress and wear.
Shin-Etsu Polymer’s knowledge in micromoulding is used to create low internal tension ultrathin films starting from 3 μm of thickness.

Features:

  • Ultra thin film created by non-stretching micro moulding in low crystallizing state
  • High tensile strength and rigidity
  • Superior heat tolerance
  • Superior friction resistance
  • Superior chemical resistance
  • Roughening of film surface optional
  • Sliding and conductivity characteristics optional (composite blending)

Applications for Sepla Film®:

  • Acoustic membrane for speakers for small handheld devices
  • Isolation layers in multilayer PCB or antenna for high frequency devices like 5G network terminals or network devices
  • Isolation of wires for EV motors or wires in harsh environment applications
  • Interior panels for airplanes

Shin-Etsu Sepla Film® - extended material property comparison

 UnitPA9TPEEKTest method
Crystalline/Amorphous-CrystallineCrystalline
Specific gravity- 1.141.31
Glass transition point
Melting point
°C125
300
146
339
DSC
ΔT: 10°C/min.
Linear expansion coefficientMD*
TD*
°C-1 31 • 10^-6
101 • 10^-6
JIS K7197
ΔT: 5°C/min.
Elasticity or Tensile ModulusMD*
TD*
N/mm22168
2183
3720
2940
JIS K6781
(23°C/50%RH)
test speed: 50 mm/min.
Yield strengthMD*
TD*
N/mm2-80
75
Tensile strengthMD*
TD*
N/mm281
84
135
83
ElongationMD*
TD*
%223
235
72
239
Breakdown voltagekV/mm22.6JIS C2110
Elec cylinder: (23°C/50%RH)
Dielectric strengthkV/mm-16
Dielectric constant--3.30
Dielectric tangential loss--0.003 (1 GHz)
Thermal conductivityW/m•K0.25
Flame retardance (UL94)--V-0
(1.5 mm)
Water absorbing property
(23°C / 24 hrs)
--0.1
Densitykg/dm31.32
Gas permeabilityO2
N2
CO2
cc(stp)/m23.0 • 10^3
7.5 • 10^1
5.9 • 10^3
JIS K7126-1
(Diff pressure method)
(24 hrs @ atm)
* MD is machining direction / TD is transverse direction.

PEEK - extended material property at 120 ºC

 UnitT = 3 µmT = 7 µm
Tensile strengthMD*
TD*
N/mm269
59
67
45
Tensile strain at breakMD*
TD*
%107
243
94
192
Modulus of elasticity in tension (Young)
MD*
TD*
N/mm21980
1380
1970
1550
Degree of crystallization%< 1020 ~ 30
* MD is machining direction / TD is transverse direction
Test method: JIS K7160-3 (120°C), tensile speed: 50 mm/min.

PEEK film dimensions and tolerances

 UnitValue
Thickness of film Tµm3 ~ 50 ± 5% *
6 ~ 250 ± 5% **
Width of film (on roll) Wmm
650 or 1310
Length of film on roll (max)Lm 2000 (3~6 µm T)
1000 (7~20 µm T)
750 (21~25 µm T)
300 (26~50 µm T)
Core of roll inch 3 or 6
* Non-stretched film of amorphous plastics
** Non-stretched and high crystallized film of crystallized plastics
The average value complaint with JIS C2330:2010 and IEC60674-3-1:1998 (n5*20)

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