T.I.M. soft pads
Shin-Etsu T.I.M. material series of soft and ultra soft pads for semiconductiors, semiconductor substrates and modules.
- Excellent performance due to low to ultra low hardness
- Sheet thickness 0.5 ~ 10 mm
- Reducing contact thermal resistance by filling surface unevenness of modules
- Reducing mechanical stress on components
- High electric insulation and flame resistance.
- Semiconductors with mounted heatsinks, LED modules and Automotive modules
- EV batteries
- PCB to die-cast heatsinks.
| Soft and Ultra Soft pad application
Cooling Semiconductors and Semiconductor module substrates
| Ultra Soft pad application
Cooling PCB substrates
|TC-SP-1.7 / TC-SPA-3.0||TC-CAS-10 / CAB-10 / CAD-10 / CAT-20||TC-CAF-40|