T.I.M. soft pads
Shin-Etsu T.I.M. material series of soft and ultra soft pads for semiconductiors, semiconductor substrates and modules.

Features:
- Excellent performance due to low to ultra low hardness
- Sheet thickness 0.5 ~ 10 mm
- Reducing contact thermal resistance by filling surface unevenness of modules
- Reducing mechanical stress on components
- High electric insulation and flame resistance.
Applications:
- Semiconductors with mounted heatsinks, LED modules and Automotive modules
- EV batteries
- PCB to die-cast heatsinks.
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Soft and Ultra Soft pad application Cooling Semiconductors and Semiconductor module substrates |
Ultra Soft pad application Cooling PCB substrates |
TC-SP-1.7 / TC-SPA-3.0 | TC-CAS-10 / CAB-10 / CAD-10 / CAT-20 | TC-CAF-40 |