T.I.M. hard pads

Shin-Etsu T.I.M. material series of hard pads for power transistors.
 
Features:
  • Excellent performance due to high hardness
  • Sheet thickness 0.11 mm or more
  • Glass fiber or polyimide film reinforcement layer to obtain high physical strength
  • High electric insulation and flame resistance
  • One side adhesive optional
  • Moulded shapes like caps, tubes and custom designs available.
 
Applications:
  • Power transistors for power supplies, power modules, energy convertors and automotive electronics
  • Thermal clad interposer for heatbonding anisotropic adhesive tape.
Applications
   
 TA series pads between Heatsink
 and Power Transistor
 Power Transistor example
T.I.M. hard pad series datasheets
 TC-TA-series