T.I.M. hard pads
Shin-Etsu T.I.M. material series of hard pads for power transistors.
- Excellent performance due to high hardness
- Sheet thickness 0.11 mm or more
- Glass fiber or polyimide film reinforcement layer to obtain high physical strength
- High electric insulation and flame resistance
- One side adhesive optional
- Moulded shapes like caps, tubes and custom designs available.
- Power transistors for power supplies, power modules, energy convertors and automotive electronics
- Thermal clad interposer for heatbonding anisotropic adhesive tape.
| TA series pads between Heatsink
and Power Transistor
|Power Transistor example|