MT-type of Inter-Connector

The MT-type of Inter-Connector, used for testing IC-devices in packages like BGA, QFP, SOP, Flip-Chip or Bumped Wafers, consists of parallel rows of gold-plated brass wires in a silicone rubber sheet.
Wires are positioned under an angle of 60° to ease compression and improve durability. The wire angle of 60° requires contacts to use an offset of half the thickness of the silicone rubber sheet. Randomly positioning the Inter-Connector between contact pads and providing compresssion wil realize a stable, low resistance connection.
Proper connection is provided by compression forces of 0.2 ~ 0.5 N per contact ball or land on the IC device, depending on the contact size and shape.

The MT-type is one of the derivatives of the GB-type and the base of several versions of MT-types dedicated to specialized fields of device testing. The MT-4X is having a 4 times higher wire density for fine pitch IC devices. The MT-T is providing ultra high signal transmission up to 13 Ghz due to its small sheet thickness. The MT-P is having wires protruding the sheet surface by 20 µm to ease contacting ultra fine and mechanically sensitive devices with flat contacts like LGA packages. The protruded wires of the MT-P-type are Ni/Au-plated.

Outline Dimensions and application
       
 MT-, MT-4X-, MT-T- or MT-P-type  Tester socket to fix the MT-type and guide the IC device for testing  MT-4X-type 0.5T
       
 Wiring MT / MT-4X

 Wiring MT-T

 Wiring MT-P
 wires protrude the surface
 MT-P-type 0.15T

  

Dimensions and Tolerances
   

 Unit

 MT-type  MT-4X-type  MT-T-type  MT-T-4X-type  MT-P-type
 Pitch  P  mm  0.10±0.03  0.05±0.03  0.10±0.03  0.05±0.03  0.10±0.03
 Pitch  Ps  mm  0.10±0.05  0.05±0.03  0.10±0.05  0.05±0.03  0.10±0.05
 Sheet thickness  T  mm  0.5 +0.05/-0.0
 1.0 +0.05/-0.0
 2.0 +0.05/-0.0 
 0.10 +0.05/-0.0
 0.25 +0.05/-0.0

 0.15 +0.05/-0.0
 0.25 +0.05/-0.0
 
 0.15 +0.05/-0.0
 0.25 +0.05/-0.0

 Length *  L  mm  5.0 ~ 25.0±0.5
 25.1 ~ 50.0±1.0 
 0.15T: 5.0 ~ 10.0
 0.25T: 5.0 ~ 50.0
 5.0 ~ 25.0±0.5
 25.1 ~ 50.0±1.0 
 Width *  W  mm  5.0 ~ 25.0±0.5
 25.1 ~ 50.0±1.0 
 0.15T: 5.0 ~ 10.0
 0.25T: 5.0 ~ 50.0
 5.0 ~ 25.0±0.5
 25.1 ~ 50.0±1.0 
 Conductive fiber diameter    µm  40 
 Au-plated brass

 23
 Au-plated BeCu

 40
 Au-plated brass
 23
 Au-plated BeCu
 40
 Au-plated brass

 * Sizes larger or smaller available on request.

Basic Properties
   Unit  
 Contact resistance  Ω  < 0.1
 Current carrying capacity **  mA/wire  50
 Dielectric breakdown voltage  kV/mm  23 ~ 27
 Isolation resistance (500V DC) ***  MΩ  > 1.0 • 103
 Operating temperature range  °C  -35 ~ 100

** Tests carried out with Shin-Etsu standard methods.
*** Average when using muliple wires per electric connection.

Compression Curves *
   
 MT-type load characteristic
 MT-type thicknesses 0.5, 1.0 and 2.0 mm
 Durability test on 0.5T MT-type
 Test pin diameter 0.5 mm. Deflection 0.3 mm.
   
 MT-T-type load graph based on 0.3 x 0.4 mm electrode  MT-T-4X-type load graph based on 0.2 x 0.3 mm electrode
   
 Comparison MT-T-type and MT-P-type
 
 S21 transmission parameter MT-T-type.
 MT-T-type thickness 0.1 mm. DUT-pitch 0.5 mm.

 * All graphs based on specific tests according Shin-Etsu standards. Detailed reports available on request.

Attention:
The wires are positioned as rows of wires; not exactly in a matrix structure.
The MT-type is generally used with a fixation and alignment frame that is not include by the MT-type.
A small amount of silicone will remain on the substrates connected by the MT-type of Inter-Connector.
When devices with solder bumps are pressed onto the MT-type, solder residue may adhesere to the metal filaments of the Inter-Connector.
Contamination like dirst and dust will remarkably increase the contact resistance of the Inter-Connector.

Note:
Shin-Etsu Inter-Connector has been registered in the European Community, TM No. 000299016, and in the United States of America, TM No. 2078941.
Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
Compression curves are for reference only. Actual resistances and compression forces are up to the design of substrates and holder constructions.
More information can be found in the design guides.
The quality of the assembled Inter-Connector is out of guarantee.
Please make sure to review the purpose and conditions of use and practice your own tests.
Industrial ownership like patent doesn't guarantee the usage of the Inter-Connector.