MAF-type of Inter-Connector
The MAF-type of Inter-Connector, developed for small height connections and testing substrates of PCB's or FPC's and electronic components, is a anisotropic sheet of silicone rubber with brass fibers dispersed in the Z-axis. The protruded surfaces of the bras fibers are gold plated.
Custom designs are generated by punching out required shapes from standardized sheet sizes. Additional adhesive layer are available to ease assembly. Fibers protrude the adhesive layer.
|FPC connection in camera||PCB tester|
|Sheet thickness||T||mm|| 0.2 ± 0.05
0.3 ± 0.05
0.4 ± 0.05
0.5 ± 0.05
|Length||L||mm||1.0 ~ 300.0|
|Width||W||mm||1.0 ~ 50.0|
|Conductive fiber diameter||µm||30|
|Shore hardness A||ISO7619A||65 ~ 73|
|Compression set *||%||30 ~ 35|
|Current carrying capacity **||A/mm2||1.0|
|Contact resistance||Ω/mm2|| ≤ 0.1
|Dielectric breakdown voltage||kV/mm||23 ~ 27|
|Isolation resistance (500V DC) ***||MΩ||> 1.0 • 103|
|Operating temperature range||°C||-25 ~ 85|
* Tested 3000 hrs at room temperature.
** 4 wired method, applied current 1 - 10 mA, minimum electrode area shown in graph below.
*** 500 V DC is applied at the area between minimum electrode sizes shown in graph below.
|sample size: 0.2 mm T|| samples size: 0.2 mm T, 0.15 mm2 Au-plated electrode
samples size: 0.4 mm T, 0.4 mm2 Au-plated electrode
Shin-Etsu Inter-Connector has been registered in the European Community, TM No. 000299016, and in the United States of America, TM No. 2078941.
Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
Compression curves are for reference only. Actual resistances and compression forces are up to the design of substrates and holder constructions.
More information can be found in the design guides.
The quality of the assembled Inter-Connector is out of guarantee.
Please make sure to review the purpose and conditions of use and practice you own tests.
Industrial ownership like patent doesn't guarantee the usage of the Inter-Connector.