GB-Matrix-type of Inter-Connector
The GB-matrix-type of Inter-Connector, used for board to board and component to board connections, mainly for permanent connections, consists of parallel rows of gold-plated brass wires in a silicone rubber sheet. Randomly positioning the Inter-Connector between contact pads and providing compression will realize a stable, low resistance connection.
The GB-matrix-type is one of the derivatives of the GB-type. Dimensions and pitches are designed to customer requirements.
For testing purposes, the MT-types are more suitable, having tilted wires to ease compression and improve durability for multi compression.
|GB-Matrix-type||GB-Matrix-type application HDD|
|Length||L||mm|| 2.0 ~ 25.0 ± 0.2
25.1 ~ 50.0 ± 0.3
|Width||W||mm|| 2.0 ~ 25.0 ± 0.2
25.1 ~ 50.0 ± 0.3
|Thickness||T||mm||0.3 ~ 2.5 ± 0.05|
Adhesive on one side available on request.
Special designs with comoulded sections available on request.
|Contact resistance *||Ω||≤ 0.1|
|Current carrying capacity **||mA/wire||50|
|Dielectric breakdown voltage isolator||kV/mm||23 ~ 27|
|Isolation resistance (500V DC) *||MΩ||> 1.0 • 103|
|Operating temperature range||°C||-25 ~ 85|
* Tests carried out with Shin-Etsu standard methods.
** Average when using multiple wires per electric connection.
| samples size: 0.1P 0.25Ps 0.3T
electrode 1: 0.15 mm x 0.5 mm Au-plated Cu pad
electrode 2: Au-plated Cu-plate
Shin-Etsu Inter-Connector has been registered in the European Community, TM No. 000299016, and in the United States of America, TM No. 2078941.
Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
Compression curves are for reference only. Actual resistances and compression forces are up to the design of substrates and holder constructions.
More information can be found in the design guides.
The quality of the assembled Inter-Connector is out of guarantee.
Please make sure to review the purpose and conditions of use and practice your own tests.
Industrial ownership like patent doesn't guarantee the usage of the Inter-Connector.