Design guide heat-seal Inter-Connectors

To achieve reliable connections with Shin-Etsu heatseal Inter-Connectors, the outline and construction of the Inter-Connector, together with proper bonding equipment and sealing conditions are important.

Furthermore, design and thickness of tracks on the PCB or FPC can affect the bonding process due to the heat absorption of the copper tracks and the distribution of the bonding pressure over the adhesive .

A full design guide for the heatseal Inter-Connectors is available on request.



Shin-Etsu Inter-Connector has been registered in the European Community, TM No. 000299016, and in the United States of America, TM No. 2078941.
Every item or numerical value indicated herein is measured by Shin-Etsu and out of guarantee.
Compression curves are for reference only. Actual resistances and compression forces are up to the design of substrates and holder constructions.
More information can be found in the design guides.
The quality of the assembled Inter-Connector is out of guarantee.
Please make sure to review the purpose and conditions of use and practice your own tests.
Industrial ownership like patent doesn't guarantee the usage of the Inter-Connector.